Leading high-speed design capabilities
Comprehensive high-speed platformOver 20 years of design experience
Supported by 80+ engineers with solid theoretical knowledge
Full-system simulations for accurate and problem-solving expertise
System SolutionsFast: Simulation and design are completed concurrently
Complete: Full coverage of simulations, directly targeting critical issues
Precise: 112G high-speed simulation technology, forming a closed loop with testing
Empowering diverse industriesHelps customers achieve first-time success
Low cost, high quality
Broad customer coverage
Covering Internet, servers, switches, ICT, and more
Capabilities includeIEEE: 10G/25G/28G/56G/112G
DDR5,GDDR6
PCIe 5, USB 3.0, SAS/SATA
IR Drop, PDN impedance analysis
Thermal and transient simulations
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Deeply Accumulated
PCB Platform Capabilities
- 20+ years
PCB design and R&D experience
- Up to 34 layers
Up to 92,000 pins
- 300+
Design specifications, case studies, and operational guidelines, with a robust training and knowledge-sharing culture
- Early collaboration with leading domestic
chip companies for forward-looking technology accumulation
- 20+ years
ComprehensiveSystem-Level Structural Design Capabilities
Wide Business Support
Structural, industrial, and packaging design
Cable and labeling design
High-Performance Design Guarantee
DFX, structural rigidity simulation
Mechanical dynamics simulation, ergonomic simulation
Thermal Design and Energy Efficiency
Advanced thermal platforms and testing
Efficient heat dissipation and innovative liquid cooling research
Flexible immersion cooling and air/liquid-cooled solutions
Advanced thermal design capabilities
- 01 Air cooling schemeAir cooled compatible cold plate solution
Supports single-chip power 800W+
23 W 800G QSFP - 02 Cold plate liquid cooling solutionSingle phase cold plate liquid cooling scheme
With low flow resistance, low cost, high reliability
Flexible quick-connect (manual plug/unplug and blind-mate insertion) - 03 Submerged liquid cooling solutionSingle-phase, two-phase submerged liquid cooling scheme
Horizontal tank and vertical cabinet blind-mate insertion
Intelligent alert strategy
Material compatibility and reliability - 04 Fanless cooling designShortest thermal conductivity path scheme
Wide temperature range of 70 °C
SFP+ 80 km
Complexprocess design capabilities
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- High-Complexity Single-Board Assembly Technology
- Extensive experience in assembling highly complex PCBs, large BGA chips, and large-format boards, with proven successful case studies
92k-pinhigh-complexity PCBs
Ultra-large PCBs up to1000mm
Extra-large chips90×80mm
Ultra-fine-pitch components0.35mm
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- Long-term reliability verification solutions
- Full lifecycle reliability validation, including stress simulation, stress testing, red ink analysis, and cross-section inspection, forming a complete closed-loop process from design simulation to process verification
Board-level stresssimulation analysis
PCBPCB stress testing
Red ink testing
Cross-section analysis
Ten Specialized Laboratories
Establishes a comprehensive product reliability center for the company
Provides rigorous testing and inspection across hundreds of projects for all products, from components to complete systems, covering signal integrity, safety, EMC, environmental adaptability, and overall reliability
Ensures high product reliability, forms the foundation for domestic and international certifications, and builds customer trust
HALT Laboratory
Climatic Environmental Laboratory
Mechanical Environmental Laboratory
Component Analysis Laboratory
Process Laboratory
Anechoic Chamber
EMS Laboratory
Structural Laboratory
Safety Laboratory
Drop Test Laboratory
- HALT Laboratory
- Climatic Environmental Laboratory
- Mechanical Environmental Laboratory
- Component Analysis Laboratory
- Process Laboratory
- Anechoic Chamber
- EMS Laboratory
- Structural Laboratory
- Safety Laboratory
- Drop Test Laboratory
Laboratories






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